Product summary 1.1.
Fully automatic flexible taping machine hi high-precision automated packaging equipment electronic components (chip, capacitor, resistor, LEDs, etc. ang chi) atana siam a ni a, hei hi a man tlawm ber a ni. Chip, precision hardware, nickel sheet, micro capacitor leh resistor, shielding covers taping-ah te hman a ni nasa hle a, a tlangpuiin batch tenau leh chi hrang hrang nen a inmil hle. Flexible vibration feeding system, visual material selection and detection system, leh host computer system hmanga siam niin, bulk materials te chu automatic-in an ruahman a (square direction-a hriat theihin), carrier-ah dahin, production efficiency leh packaging consistency nasa takin an tichangtlung a, tunlai electronic manufacturing industry-in precision components standardized packaging a mamawhna a phuhruk a, electronic manufacturing company tam tak tan electronic manufacturing company tam takte chu an inelna tichak turin a ni.
Product Features 1.1.
1.Feeding system 1000 a ni.
Plate, silo emaw robot emaw chu automatic feeding atan vibrating a ni.
2.Visual enfiahna system .
High-Precision camera (CCD/optical inspection) a ni a, component polarity, a lian leh te, a chhiatna, etc. te hriat theih a ni.
3.Taping mechanism 1.1.
Components chu carrier tape ah dik takin a embed a, sealing cover tape hmangin a khuh bawk.
4.Automatic taping machine hmanga carrier tape phurh chhuahna system .
Stepper motor emaw servo drive emaw hmangin carrier tape chu a dik taka a kal theih nan.
5.Sealing hmanrua .
Heat pressing emaw ultrasonic sealing emaw hmangin cover tape leh carrier tape chu nghet taka inzawm a nih theih nan.
6.Reel 10 a ni.
Automatically reel into reels, reel diameter hrang hrang customization a support.
Product Properties 1.1.
Flexible equipment hman tangkai dan: Advanced Flexible Vibration Feeding System atanga chhut chuan automatic taping machine hian minute 15 chhungin product switching rang tak a nei thei a, product scratch rate a tihhniam theih bakah batch tenau leh chi hrang hrang siam chhuahna mamawh a phuhruk thei bawk. Semiconductor components, chips, integrated circuits, emaw precision hardware, nickel sheet, micro capacitor leh resistor, shielding cover leh electronic component dangte pawh nise, awlsam takin a handle thei
Visual recognition leh inspection dik tak: High-Pixel camera leh advanced visual material thlan leh inspection system hmanga thuam a nih avangin all{{1} round, high-precision inspection chu coarse positioning atanga fine positioning of components ah a thleng thei a ni. High-speed camera leh AI algorithms te thawhhona hnathawh hmangin component size, shape, angle leh surface defects te chu real time-in a capture thei a ni.
High-Precision collaborative work: Positioning zawhah component te chu pickup leh servo-driven robot arm hmanga dah a ni. Robot arm ah hian adaptive gripper a awm a, chu chuan component type angin gripping force chu automatic in a siam rem thei a ni.
Flexible packaging leh rewinding: Nozzle hi rang takin a danglam thei a, hot-sealing leh cold-sealing packaging modes te hi component chi hrang hrang packaging mamawh phuhruk nan an support bawk. Hot-sealing mode-ah chuan heated blade chuan cover tape leh carrier tape chu a melt thei a, a temperature chu a zau zawnga control theih a ni a, chu chuan seal nghet tak a siam thei ang Cold-sealing mode hi heat-sensitive components atan a tha a, self-adhesive cover tape hmang hian sealing chu heating tel lovin tihfel theih a ni.
Automatic taping machine core a components te pawh a awm bawk.
Product hman dan tur .
● Hman dan tur scenario: Semiconductor packaging front-End process, passive component mass production, automotive electronic component packaging, medical electronic precision packaging, etc.
● Hman dan tur: semiconductor leh chip siamna (The high-Equipment-a high{-precision visual recognition leh robotic arm operation chuan taping process chhunga chip kalna tur dik tak leh a awmna tur dik tak a enfiah a, chu chuan a hnu lama dahkhawmna, phurh leh hmanna tur atana guarantee rintlak tak a pe a, chu chu electronic component siam chhuah, micro capacitors, resictors, leh inductors, leh active components te, diodes, leh diodes, leh prediodes, leh prediodes te tan a ni. Covers, etc., hmanrua te hian taping packaging rang leh dik tak a nei thei), consumer electronics leh communication equipment siamna (equipment te hian a hun taka a hun taka a chhan theih danin a inthlak rang a, a siam chhuah dan tur a sawi chiang hle a, a siam chhuah dan tur pawh a sang thei bawk a, mobile phone, tablet, smart wearable, communication base station leh thil dang atana electronic component te taping atan rintlak takin a pui thei bawk a ni), etc.
Fully automatic flexible taping machine hi electronic component packaging lama benchmark thar a ni chho mek a, a core advantages chu precision sang, high flexibility leh high stability a ni. Industry pain points efficiency hniam leh traditional manual tape arrangement-a consistency tha lo tak takte a chinfel mai bakah, high{{1} tawp lama semiconductors, automotive electronics, leh precision packaging atana medical equipment-te mamawh khauh tak takte chu intelligent leh modular design hmanga precision packaging atana hman a ni a, factory hrang hranga model thlak fo thin, leh small time{2} leh man to tak tak, leh man to tak tak neia model changeover-te harsatna chu a chinfel sak bawk a ni. Flexible taping machine tha leh fing tak i zawng a nih chuan Huizhou Zhongke Advanced Manufacturing Co., Ltd.
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hot tags .: A rilru a buai em em a, a rilru a hah em em bawk a, a rilru a buai em em bawk a.
Technical Parameters 1000 a ni.
● Thlipui na: 0.5~0.7mpa
● A theihna:2000-4000 pcs/h
● A dikna: +0.1mm .
● A hman theih tur parts size:<50mm
Product Specification 1000 a ni.
|
Entawn tlak |
300G |
|
Silo a ni a . |
10L |
|
Vibration plate pawh a flexible hle a ni. |
LC300 a ni. |
|
Flexible feeding software . |
LCVISON V6 a ni a. |
|
A soft vibration disk camera a ni. |
2000W |
|
Nozzle/clip a ni. |
Non-standard customization . |
|
Tray Specifications 1.1. |
7 inches/13 inches a ni. |
|
Bag seal dan tur . |
Heat seal/self seal/printing (a duh chuan) . |
|
Positioning dikna . |
+0.1MM a ni. |
|
Hmuh theihna kalphung . |
Hma lam leh hnung lam hriat/direction detection/size detection . (duh zawk thlang) |
